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Co-authors
- Dae-Yoon KimKorea Institute of Science and TechnologyVerified email at kist.re.kr
- Stephen Z. D. ChengUniversity of Akron, South China University of Technology, Donghua University, RensselaerVerified email at uakron.edu
- Dong-Gue KangUniversity of PennsylvaniaVerified email at seas.upenn.edu
- Shiao-Wei KuoDepartment of Materials and Optoelectronic Science, National Sun Yat Sen University, TaiwanVerified email at faculty.nsysu.edu.tw
- Seok-Ho HwangDankook UniversityVerified email at dankook.ac.kr
- Joong Hee LeeDistinguish Professor, Nano Convergence Engineering, Jeonbuk National University=Chonbuk NationalVerified email at jbnu.ac.kr
- Soeun KimKorea Institute of Science and TechnologyVerified email at kist.re.kr
- Kyung Min LeeAir Force Research Lab., WPAFBVerified email at wpafb.af.mil
- Chih-Hao HsuLawrence Berkeley National Laboratory, University of AkronVerified email at zips.uakron.edu
- Crystina---Cao YanShenzhen UniversityVerified email at szu.edu.cn
- Edwin L. ThomasTAMU or Rice or MIT or UMassachusetts or UMinnesota or Cornell UniversityVerified email at mit.edu
- Hak Yong KimJeonbuk National UniversityVerified email at jbnu.ac.kr
- Chih-Feng Wang (王志逢)Institute of Advanced Semiconductor Packaging and TestingVerified email at mail.nsysu.edu.tw
- George R. NewkomeFlorida Atlantic University; Professor Emeritus, University of AkronVerified email at fau.edu
- Hao-Jan SunUniversity of Pennsylvania, The University of AkronVerified email at zips.uakron.edu
- Wen-Bin ZhangPeking University; California Institute of Technology; The University of AkronVerified email at pku.edu.cn
- Tae-Wook KimChonbuk National University (Jeonbuk National University)Verified email at jbnu.ac.kr
- In Hwan LeeDepartment of Materials Science & Engineering, Korea UniversityVerified email at korea.ac.kr
- Jang-Joo KimSeoul National UniversityVerified email at snu.ac.kr
- Timothy J. WhiteUniversity of ColoradoVerified email at colorado.edu