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Jikai Xu
Jikai Xu
Harbin Institute of Technology
Verified email at u.nus.edu
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Cited by
Year
Nanometer-scale heterogeneous interfacial sapphire wafer bonding for enabling plasmonic-enhanced nanofluidic mid-infrared spectroscopy
J Xu, Z Ren, B Dong, X Liu, C Wang, Y Tian, C Lee
ACS nano 14 (9), 12159-12172, 2020
762020
Volatile organic compounds sensing based on Bennet doubler-inspired triboelectric nanogenerator and machine learning-assisted ion mobility analysis
J Zhu, Z Sun, J Xu, RD Walczak, JA Dziuban, C Lee
Science Bulletin 66 (12), 1176-1185, 2021
592021
Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O 3 activation
J Xu, C Wang, T Wang, Y Wang, Q Kang, Y Liu, Y Tian
RSC advances 8 (21), 11528-11535, 2018
552018
Glass-on-LiNbO3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method
J Xu, C Wang, Y Tian, B Wu, S Wang, H Zhang
Applied Surface Science 459, 621-629, 2018
492018
Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5G
Z Ren, J Xu, X Le, C Lee
Micromachines 12 (8), 946, 2021
472021
Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process
J Xu, C Wang, T Wang, Y Liu, Y Tian
Applied Surface Science 453, 416-422, 2018
382018
Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics
J Xu, Y Du, Y Tian, C Wang
International Journal of Optomechatronics 14 (1), 94-118, 2020
322020
Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature
J Xu, C Wang, D Li, J Cheng, Y Wang, C Hang, Y Tian
Ceramics International 45 (3), 4094-4098, 2019
292019
A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation
C Wang, J Xu, S Guo, Q Kang, Y Wang, Y Wang, Y Tian
Applied Surface Science 471, 196-204, 2019
272019
Direct bonding of high dielectric oxides for high-performance transistor applications
J Xu, C Wang, X Ji, Q An, Y Tian, T Suga
Scripta Materialia 178, 307-312, 2020
232020
Direct homo/heterogeneous bonding of silicon and glass using vacuum ultraviolet irradiation in air
C Wang, J Xu, X Qi, Y Liu, Y Tian, C Wang, T Suga
Journal of The Electrochemical Society 165 (4), H3093, 2018
192018
Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning
C Wang, J Xu, X Zeng, Y Tian, C Wang, T Suga
Japanese Journal of Applied Physics 57 (2S1), 02BD02, 2017
182017
VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices
J Xu, C Wang, R Zhang, J Cheng, G Li, J Xiang, Y Tian
Applied Surface Science 495, 143576, 2019
172019
Low-temperature direct bonding of Si and quartz glass using the APTES modification
J Xu, C Wang, S Zhou, R Zhang, Y Tian
Ceramics International 45 (13), 16670-16675, 2019
172019
Communication—defect-free direct bonding for high-performance glass-on-LiNbO3 devices
J Xu, C Wang, B Wu, Y Tian, X Qi
Journal of the Electrochemical Society 165 (14), B727, 2018
102018
Direct heterogeneous bonding of SiC to Si, SiO2, and glass for high-performance power electronics and bio-MEMS
J Xu, C Wang, Q Kang, S Zhou, Y Tian
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1266-1271, 2019
72019
VUV/O3activated bonder for low-temperature direct bonding of Si-based materials
J Xu, C Wang, X Qi, B Wu, S Zhou, Y Tian
2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018
22018
Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation
C Wang, J Xu, X Zeng, Y Tian, C Wang, T Suga
2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017
12017
A novel surface humidity controlled bonder for low-temperature wafer bonding
C Wang, J Xu, Y Liu, Y Tian, C Wang, T Suga
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
12016
Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing
J Xu, Z Ren, B Dong, C Wang, Y Tian, C Lee
Advanced MEMS/NEMS Fabrication and Sensors, 187-215, 2022
2022
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Articles 1–20