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chongxin shanZhengzhou UniversityVerified email at zzu.edu.cn
Longhui (Stephen) ZENGUniversity of California, San DiegoVerified email at ucsd.edu
Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
Dongwen YangJilin universityVerified email at mails.jlu.edu.cn
Chao Xie(谢超)Anhui UniversityVerified email at ahu.edu.cn
Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Huiyu YuanZhengzhou UniversityVerified email at zzu.edu.cn
Fengxia LiangHefei University of Technology (合肥工业大学)Verified email at hfut.edu.cn
Lijun ZhangVerified email at ios.ac.cn
Xinzheng LanHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Vivian YamChair Professor of Chemistry, The University of Hong KongVerified email at hku.hk
Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
Yang ChaiUniversity of Southern CaliforniaVerified email at usc.edu
Shenghuang Lin(林生晃)Songshan Lake Materials LaboratoryVerified email at sslab.org.cn
Lei ChenHefei University of TechnologyVerified email at hfut.edu.cn
Follow![Di Wu (吴翟)](https://scholar.googleusercontent.com/citations?view_op=view_photo&user=sHl0dOIAAAAJ&citpid=5)
Di Wu (吴翟)
Professor, School of Physics and Microelectronics, Zhengzhou University
Verified email at zzu.edu.cn