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Co-authors
Himanshu MadanIntel, PennState UniversityVerified email at intel.com
Brian R. BennettWashington-Liberty High School; formerly Naval Research Laboratory (NRL), ONR, and MITVerified email at navy.mil
Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com
Rajiv MisraUniversity of Florida, The Pennsylvania State UniversityVerified email at ufl.edu
Dheeraj MohataSenior Integration Engineer, GCS IncVerified email at gcsincorp.com
Prof. Mantu HudaitAssoc. Prof. of ECE, Virginia Tech; Past: Intel Corporation, Ohio State U, IISc-Bangalore, IIT-KGPVerified email at vt.edu
Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
Alexander P. KirkU.S. Department of EnergyVerified email at ee.doe.gov
Jeffrey LindemuthLake Shore CryotronicsVerified email at lakeshore.com
Matthew J. HollanderPennsylvania State UniversityVerified email at psu.edu
Lu LiuIntel CorporationVerified email at intel.com
Bijesh RajamohananSanDisk
Dr. Satyam SuwasProfessor of Materials Engineering, Indian Institute of Science, BangaloreVerified email at iisc.ac.in
N P GURAOMaterials Science and Engineering, Indian Institute of Technology Kanpur, IndiaVerified email at iitk.ac.in