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Co-authors
- Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
- Daeyeong LeeSamsumg ElectronicsVerified email at samsung.com
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Xiaochi Liu 刘晓迟School of Physics, Central South UniversityVerified email at csu.edu.cn
- Deshun QuPh.D, SAINT, Sungkyunkwan UniversityVerified email at skku.edu
- Inyong MoonSungkyunkwan UniversityVerified email at skku.edu
- Changsik KimSKKU Advanced Institute of Nano Technology, Sungkyunkwan UniversityVerified email at skku.edu
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- Zheng YangKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Huamin LiAssociate Professor, University at BuffaloVerified email at buffalo.edu
- E. H. HwangSungKyunKwan UniversityVerified email at skku.edu
- Changgu LeeSungkyunkwan UniversityVerified email at skku.edu
- Ganesh SamudraAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
- Wan Sik HwangKorea Aerospace UniversityVerified email at kau.ac.kr
- Tien Dat NgoimecVerified email at imec.be
- Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
- James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Ankur NipaneIntel CorporationVerified email at intel.com
- Albert ChinNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw