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Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
Daeyeong LeeSamsumg ElectronicsVerified email at samsung.com
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Xiaochi Liu 刘晓迟School of Physics, Central South UniversityVerified email at csu.edu.cn
Deshun QuPh.D, SAINT, Sungkyunkwan UniversityVerified email at skku.edu
Inyong MoonSungkyunkwan UniversityVerified email at skku.edu
Changsik KimSKKU Advanced Institute of Nano Technology, Sungkyunkwan UniversityVerified email at skku.edu
Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
Huamin LiAssistant Professor, University at BuffaloVerified email at buffalo.edu
Zheng YangKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
E. H. HwangSungKyunKwan UniversityVerified email at skku.edu
Changgu LeeSungkyunkwan UniversityVerified email at skku.edu
Ganesh SamudraAssociate Professor, National University of SingaporeVerified email at nus.edu.sg
Wan Sik HwangKorea Aerospace UniversityVerified email at kau.ac.kr
Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
Tien Dat NgoimecVerified email at imec.be
James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
Albert ChinNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw
Ankur NipaneIntel CorporationVerified email at intel.com