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- James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
- Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Abhinandan BorahNavitas SemiconductorVerified email at navitassemi.com
- Won Jong YooProfessor of Sungkyunkwan UniversityVerified email at skku.edu
- Saurabh LodhaProfessor, Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
- Naveen kaushikMicron TechnologyVerified email at micron.com
- Younghun JungColumbia University, Postdoctoral Research ScientistVerified email at columbia.edu
- Mandar M. DeshmukhCondensed Matter Physics and Materials Science, TIFR, Mumbai 400005 IndiaVerified email at tifr.res.in
- Maya Narayanan NairResearch Assistant Professor, CUNY Advanced Science Research CenterVerified email at gc.cuny.edu
- Abhay PasupathyProfessor of Physics, Columbia University and Group Leader, Brookhaven National LaboratoryVerified email at columbia.edu
- Ioannis KymissisKenneth Brayer Professor of Electrical Engineering, Columbia UniversityVerified email at columbia.edu
- Ipshita DattaUrbanek-Chodorow Fellow, Stanford UniversityVerified email at columbia.edu
- Michal LipsonVerified email at columbia.edu
- Zachary A LamportSenior Scientist, ExponentVerified email at exponent.com
- Xiaoyang ZhuHoward Family Professor of Nanoscience, Columbia UniversityVerified email at columbia.edu
- P. James SchuckColumbia UniversityVerified email at columbia.edu
- Alexander KerelskyGoogleVerified email at google.com
- Daniel RhodesUniversity of Wisconsin - MadisonVerified email at wisc.edu
- Apoorv JindalPrinceton UniversityVerified email at princeton.edu