Get my own profile
Public access
View all9 articles
5 articles
available
not available
Based on funding mandates
Co-authors
James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Abhinandan BorahNavitas SemiconductorVerified email at navitassemi.com
Won Jong YooProfessor of Sungkyunkwan UniversityVerified email at skku.edu
Saurabh LodhaProfessor, Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
Naveen kaushikMicron TechnologyVerified email at micron.com
Younghun JungColumbia University, Postdoctoral Research ScientistVerified email at columbia.edu
Mandar M. DeshmukhCondensed Matter Physics and Materials Science, TIFR, Mumbai 400005 IndiaVerified email at tifr.res.in
Maya Narayanan NairResearch Assistant Professor, CUNY Advanced Science Research CenterVerified email at gc.cuny.edu
Abhay PasupathyProfessor of Physics, Columbia University and Group Leader, Brookhaven National LaboratoryVerified email at columbia.edu
Ioannis KymissisKenneth Brayer Professor of Electrical Engineering, Columbia UniversityVerified email at columbia.edu
Ipshita DattaUrbanek-Chodorow Fellow, Stanford UniversityVerified email at columbia.edu
Michal LipsonVerified email at columbia.edu
Zachary A LamportSenior Scientist, ExponentVerified email at exponent.com
Xiaoyang ZhuHoward Family Professor of Nanoscience, Columbia UniversityVerified email at columbia.edu
P. James SchuckColumbia UniversityVerified email at columbia.edu
Alexander KerelskyGoogleVerified email at google.com
Daniel RhodesUniversity of Wisconsin - MadisonVerified email at wisc.edu
Apoorv JindalPrinceton UniversityVerified email at princeton.edu