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Co-authors
- Tianli FengAssistant Professor, Mechanical Engineering, University of UtahVerified email at utah.edu
- Qiu BoPostdoctoral Associate, MITVerified email at mit.edu
- Hua BaoProfessor, Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Yong P. ChenPurdue University; Aarhus University; WPI-AIMR; MUSTVerified email at purdue.edu
- Yan WangDepartment of Mechanical Engineering, University of Nevada, RenoVerified email at unr.edu
- Joseph PeoplesR&D Engineer, IntelVerified email at purdue.edu
- Jiuning HuNational Institute of Standards and TechnologyVerified email at nist.gov
- Xiangyu LiUTK, MIT, Purdue UniversityVerified email at utk.edu
- Zherui Han (韩哲睿)Postdoctoral scholar, Stanford UniversityVerified email at stanford.edu
- Yue WuIowa State UniversityVerified email at iastate.edu
- Jingjing ShiUniversity of FloridaVerified email at ufl.edu
- Timothy S FisherMechanical & Aerospace Engineering, University of California Los AngelesVerified email at g.ucla.edu
- Massoud KavianyUniversity of MichiganVerified email at umich.edu
- Prabudhya Roy ChowdhuryModeling and Hardware Engineer, IBM ResearchVerified email at ibm.com
- Zexi LuPacific Northwest National LaboratoryVerified email at pnnl.gov
- Xiaolong Yang (杨小龙)Associate Professor at Chongqing UniversityVerified email at stu.xjtu.edu.cn
- Zhifeng HuangSchool of Power and Mechanical Engineering, Wuhan UniversityVerified email at whu.edu.cn
- Ajit K. RoyAir Force Research LaboratoryVerified email at us.af.mil
- Lucas LindsayOak Ridge National LaboratoryVerified email at ornl.gov
- Xianfan XuPurdue UniversityVerified email at purdue.edu
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Xiulin Ruan
Professor, School of Mechanical Engineering, Purdue University
Verified email at purdue.edu - Homepage