| CMOS sensor array with a shared structure YC Kim, Y Kim US Patent 7,244,920, 2007 | 96 | 2007 |
| 7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12 μm pixel with front-side deep-trench isolation and vertical transfer gate JC Ahn, K Lee, Y Kim, H Jeong, B Kim, H Kim, J Park, T Jung, W Park, ... 2014 IEEE International Solid-State Circuits Conference Digest of Technical …, 2014 | 81 | 2014 |
| Advanced image sensor technology for pixel scaling down toward 1.0 µm JC Ahn, CR Moon, B Kim, K Lee, Y Kim, M Lim, W Lee, H Park, K Moon, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 72 | 2008 |
| Unit pixels for image sensors and pixel arrays comprising the same S Lee, Y Kim, JC Ahn, YW Jung US Patent 9,609,250, 2017 | 53 | 2017 |
| CMOS active pixel sensor and active pixel sensor array using fingered type source follower transistor YC Kim, Y Kim US Patent 7,525,077, 2009 | 46 | 2009 |
| 1/2-inch 7.2 Mpixel CMOS image sensor with 2.25/spl mu/m pixels using 4-shared pixel structure for pixel-level summation YC Kim, YT Kim, SH Choi, HK Kong, SI Hwang, JH Ko, BS Kim, T Asaba, ... 2006 IEEE International Solid State Circuits Conference-Digest of Technical …, 2006 | 46* | 2006 |
| 5.6 A 1/2.65 in 44Mpixel CMOS image sensor with 0.7 µm pixels fabricated in advanced full-depth deep-trench isolation technology HC Kim, J Park, I Joe, D Kwon, JH Kim, D Cho, T Lee, C Lee, H Park, ... 2020 IEEE International Solid-State Circuits Conference-(ISSCC), 104-106, 2020 | 45 | 2020 |
| 7.1 A 4-tap 3.5 μm 1.2 Mpixel indirect time-of-flight CMOS image sensor with peak current mitigation and multi-user interference cancellation MS Keel, D Kim, Y Kim, M Bae, M Ki, B Chung, S Son, H Lee, H Jo, ... 2021 IEEE International Solid-State Circuits Conference (ISSCC) 64, 106-108, 2021 | 37 | 2021 |
| A 0.8 µm smart dual conversion gain pixel for 64 megapixels CMOS image sensor with 12k e-full-well capacitance and low dark noise D Park, SW Lee, J Han, D Jang, H Kwon, S Cha, M Kim, H Lee, S Suh, ... 2019 IEEE International Electron Devices Meeting (IEDM), 16.2. 1-16.2. 4, 2019 | 37 | 2019 |
| 7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation JE Park, S Park, K Cho, T Lee, C Lee, DH Kim, B Lee, SI Kim, HC Ji, ... 2021 IEEE International Solid-State Circuits Conference (ISSCC) 64, 122-124, 2021 | 36 | 2021 |
| A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9 μm unit pixels separated by full-depth deep-trench isolation Y Kim, W Choi, D Park, H Jeoung, B Kim, Y Oh, S Oh, B Park, E Kim, ... 2018 IEEE International Solid-State Circuits Conference-(ISSCC), 84-86, 2018 | 36 | 2018 |
| Unit pixel of image sensor and image sensor including the same J Lee, S Jung, Y Kim, WP Yang US Patent 9,159,751, 2015 | 35 | 2015 |
| CMOS image sensor and image sensing method using the same SH Choi, JC Ahn, Y Kim, YC Kim, HK Kong US Patent 7,825,970, 2010 | 35 | 2010 |
| Method Of Driving An Image Sensor JC Ahn, Y Kim US Patent App. 13/233,250, 2012 | 34 | 2012 |
| A 0.8 μm nonacell for 108 megapixels CMOS image sensor with FD-shared dual conversion gain and 18,000 e-full-well capacitance Y Oh, M Kim, W Choi, H Choi, H Jeon, J Seok, Y Choi, J Jung, K Yoo, ... 2020 IEEE International Electron Devices Meeting (IEDM), 16.2. 1-16.2. 4, 2020 | 22 | 2020 |
| Image sensor and method of manufacturing the same JC Ahn, Y Kim, E Shim, KH Lee US Patent App. 14/168,657, 2014 | 21 | 2014 |
| Pixel driving circuit and method of driving the same having shared contacts with neighboring pixel circuits SH Choi, Y Kim, YC Kim, HK Kong US Patent 7,573,013, 2009 | 20 | 2009 |
| Microstructural evidence on direct contact of Au/Ge/Ni/Au ohmic metals to InGaAs channel in pseudomorphic high electron mobility transistor with undoped cap layer JL Lee, YT Kim, JY Lee Applied physics letters 73 (12), 1670-1672, 1998 | 20 | 1998 |
| A 1.2-Mpixel Indirect Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current Mitigation and Multi-User Interference Cancellation MS Keel, D Kim, Y Kim, M Bae, M Ki, B Chung, S Son, H Lee, SC Shin, ... IEEE Journal of Solid-State Circuits 56 (11), 3209-3219, 2021 | 19 | 2021 |
| Pixels for CMOS image sensors Y Kim, YC Kim, HK Kong, SH Choi US Patent App. 11/436,278, 2006 | 19 | 2006 |
