| A universal method to produce low–work function electrodes for organic electronics Y Zhou, C Fuentes-Hernandez, J Shim, J Meyer, AJ Giordano, H Li, ... Science 336 (6079), 327-332, 2012 | 2322 | 2012 |
| Ultrawide‐bandgap semiconductors: research opportunities and challenges JY Tsao, S Chowdhury, MA Hollis, D Jena, NM Johnson, KA Jones, ... Advanced Electronic Materials 4 (1), 1600501, 2018 | 1470 | 2018 |
| Thermal effects in packaging high power light emitting diode arrays A Christensen, S Graham Applied thermal engineering 29 (2-3), 364-371, 2009 | 405 | 2009 |
| β-Gallium oxide power electronics AJ Green, J Speck, G Xing, P Moens, F Allerstam, K Gumaelius, T Neyer, ... Apl Materials 10 (2), 2022 | 375 | 2022 |
| Electrical, thermal, and mechanical characterization of silicon microcantilever heaters J Lee, T Beechem, TL Wright, BA Nelson, S Graham, WP King Journal of Microelectromechanical Systems 15 (6), 1644-1655, 2006 | 281 | 2006 |
| Highly tunable molecular sieving and adsorption properties of mixed-linker zeolitic imidazolate frameworks K Eum, KC Jayachandrababu, F Rashidi, K Zhang, J Leisen, S Graham, ... Journal of the American Chemical Society 137 (12), 4191-4197, 2015 | 245 | 2015 |
| Controlled doping of large-area trilayer MoS2 with molecular reductants and oxidants. A Tarasov, S Zhang, MY Tsai, PM Campbell, S Graham, S Barlow, ... Advanced Materials (Deerfield Beach, Fla.) 27 (7), 1175-1181, 2015 | 240 | 2015 |
| Stability of doped transparent carbon nanotube electrodes R Jackson, B Domercq, R Jain, B Kippelen, S Graham Advanced Functional Materials 18 (17), 2548-2554, 2008 | 228 | 2008 |
| Invited Article: Simultaneous mapping of temperature and stress in microdevices using micro-Raman spectroscopy T Beechem, S Graham, SP Kearney, LM Phinney, JR Serrano Review of Scientific Instruments 78 (6), 2007 | 212 | 2007 |
| Interfacial thermal conductance across room-temperature-bonded GaN/diamond interfaces for GaN-on-diamond devices Z Cheng, F Mu, L Yates, T Suga, S Graham ACS applied materials & interfaces 12 (7), 8376-8384, 2020 | 183 | 2020 |
| Development of a thermal resistance model for chip-on-board packaging of high power LED arrays M Ha, S Graham Microelectronics Reliability 52 (5), 836-844, 2012 | 178 | 2012 |
| Void growth in 6061-aluminum alloy under triaxial stress state H Agarwal, AM Gokhale, S Graham, MF Horstemeyer Materials Science and Engineering: A 341 (1-2), 35-42, 2003 | 164 | 2003 |
| Experimental observation of high intrinsic thermal conductivity of AlN Z Cheng, YR Koh, A Mamun, J Shi, T Bai, K Huynh, L Yates, Z Liu, R Li, ... Physical Review Materials 4 (4), 044602, 2020 | 159 | 2020 |
| Influence of interfacial mixing on thermal boundary conductance across a chromium/silicon interface PE Hopkins, PM Norris, RJ Stevens, TE Beechem, S Graham | 157 | 2008 |
| Elastomer–polymer semiconductor blends for high-performance stretchable charge transport networks D Choi, H Kim, N Persson, PH Chu, M Chang, JH Kang, S Graham, ... Chemistry of Materials 28 (4), 1196-1204, 2016 | 155 | 2016 |
| Solution-based electrical doping of semiconducting polymer films over a limited depth VA Kolesov, C Fuentes-Hernandez, WF Chou, N Aizawa, FA Larrain, ... Nature Materials 16 (4), 474-480, 2017 | 153 | 2017 |
| Review of stability and thermal conductivity enhancements for salt hydrates N Kumar, J Hirschey, TJ LaClair, KR Gluesenkamp, S Graham Journal of Energy Storage 24, 100794, 2019 | 151 | 2019 |
| Thermal analysis of near-isothermal compressed gas energy storage system A Odukomaiya, A Abu-Heiba, KR Gluesenkamp, O Abdelaziz, ... Applied energy 179, 948-960, 2016 | 150 | 2016 |
| A practical extension of the 3ω method to multilayer structures BW Olson, S Graham, K Chen Review of Scientific Instruments 76 (5), 2005 | 149 | 2005 |
| Low thermal boundary resistance interfaces for GaN-on-diamond devices L Yates, J Anderson, X Gu, C Lee, T Bai, M Mecklenburg, T Aoki, ... ACS applied materials & interfaces 10 (28), 24302-24309, 2018 | 141 | 2018 |
Bernard KippelenJoseph M. Pettit Professor of Electrical and Computer EngineeringVerified email at gatech.edu
