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Jerry TersoffIBMVerified email at us.ibm.com- Suneel Kumar KodambakaProfessor, Materials Science and Engineering, Virginia TechVerified email at vt.edu
- Rudolf TrompIBM T.J. Watson Research Center / Leiden UniversityVerified email at us.ibm.com
- Eric StachDepartment of Materials Science and Engineering, University of PennsylvaniaVerified email at seas.upenn.edu
- Haim H BauUniversity of PennsylvaniaVerified email at seas.upenn.edu
- Nicholas M SchneiderUniversity of PennsylvaniaVerified email at seas.upenn.edu
- James B. HannonIBM Research DivisionVerified email at us.ibm.com
- Kate ReidyMiller Postdoctoral Fellow, University of California, BerkeleyVerified email at berkeley.edu
- Joachim Dahl ThomsenForschungszentrum JülichVerified email at fz-juelich.de
- Julian KleinMITVerified email at mit.edu
- Prineha NarangUCLAVerified email at ucla.edu
- Peter SearsonReynolds Professor of Engineering, Johns Hopkins UniversityVerified email at jhu.edu
- Federico PancieraC2N, CNRS/University of Paris-SaclayVerified email at c2n.upsaclay.fr
- Philippe M. VereeckenFellow/Professor imec/KULeuvenVerified email at imec.be
- Zdenek SoferUniversity of Chemistry and Technology PragueVerified email at vscht.cz
- Michael M. NortonResearch Scientist and Lecturer of Engineering, Brandeis UniversityVerified email at brandeis.edu
- Ya-Hong XieUniversity of California Los Angeles, Materials Sciences & EngineeringVerified email at ucla.edu
- Baoming WangMIT - Massachusetts Institute of TechnologyVerified email at mit.edu
- Dan SteingartColumbia UniversityVerified email at columbia.edu
- Yi-Chia ChouProfessor at National Taiwan UniversityVerified email at ntu.edu.tw
