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Co-authors
- Darrell G. SchlomCornell UniversityVerified email at cornell.edu
- Roman Engel-HerbertDirektor, Paul-Drude-Institut für Festkörperelektronik, Leibniz Institut im Foschungsverbund BerlinVerified email at pdi-berlin.de
- Nikhil ShuklaUniversity of VirginiaVerified email at virginia.edu
- Hanjong PaikAssistant Professor, School of Electrical & Computer Engineering (ECE), University of Oklahoma (OU)Verified email at ou.edu
- Srinivas TadigadapaProfessor of Electrical and Computer Engineering, Northeastern UniversityVerified email at northeastern.edu
- Venkatraman GopalanPennsylvania State UniversityVerified email at psu.edu
- Abhinav PariharVerified email at columbia.edu
- Ayan KarSynopsysVerified email at synopsys.com
- Joshua W. TashmanMass General Brigham Combined Pathology ResidencyVerified email at mgb.org
- Huichu LiuIntel Labs, Intel CorporationVerified email at intel.com
- Koen Martensimec / KU LeuvenVerified email at imec.be
- Stuart ParkinMax Planck Institute of Microstructure PhysicsVerified email at mpi-halle.mpg.de
- Brian RomanczykPostdoctoral Researcher, University of California Santa BarbaraVerified email at ece.ucsb.edu
- Sean RommelProfessor, Rochester Institute of TechnologyVerified email at rit.edu
- Rajiv MisraUniversity of Florida, The Pennsylvania State UniversityVerified email at ufl.edu
- Abdelsalam AboketafVerified email at rit.edu
- Stefan PrebleRochester Institute of TechnologyVerified email at rit.edu
- Ali W. ElshaariAssociate Professor, Docent, KTH Royal Institute of TechnologyVerified email at kth.se