| Polarization-controlled tunable directional coupling of surface plasmon polaritons J Lin, JPB Mueller, Q Wang, G Yuan, N Antoniou, XC Yuan, F Capasso Science 340 (6130), 331-334, 2013 | 1276 | 2013 |
| Nanostructured holograms for broadband manipulation of vector beams J Lin, P Genevet, MA Kats, N Antoniou, F Capasso Nano letters 13 (9), 4269-4274, 2013 | 311 | 2013 |
| Copper device editing: Strategy for focused ion beam milling of copper JD Casey Jr, M Phaneuf, C Chandler, M Megorden, KE Noll, R Schuman, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 49 | 2002 |
| In situ FIB-SEM characterization and manipulation methods N Antoniou, K Rykaczewski, MD Uchic MRS Bulletin 39 (4), 347-352, 2014 | 22 | 2014 |
| Focused ion beam induced deposition of low-resistivity copper material TJ Gannon, G Gu, JD Casey, C Huynh, N Bassom, N Antoniou Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2004 | 22 | 2004 |
| Focused ion beam induced effects on MOS transistor parameters AN Campbell, P Tangyunyong, JR Jessing, CE Hembree, DM Fleetwood, ... International Symposium for Testing and Failure Analysis 30835, 273-281, 1999 | 18 | 1999 |
| FIB micro-surgery on flip-chips from the backside R Lee, N Antoniou International Symposium for Testing and Failure Analysis 30767, 455-459, 1998 | 17 | 1998 |
| FIB backside isolation techniques M Abramo, DL Barton, RH Livengood, N Antoniou, KN Hooghan Microelectronic Failure Analysis: Desk Reference, 1-17, 2001 | 13 | 2001 |
| Failure analysis of electronic material using cryogenic FIB-SEM N Antoniou EDFA Technical Articles 15 (3), 12-19, 2013 | 12 | 2013 |
| Development of void-free focused ion beam-assisted metal deposition process for subhalf-micrometer high aspect ratio vias V Ray, N Antoniou, N Bassom, A Krechmer, A Saxonis Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2003 | 11 | 2003 |
| Development of a circuit edit process scalable in dimension and material VV Makarov, N Antoniou International Symposium for Testing and Failure Analysis 30897, 62-66, 2006 | 8 | 2006 |
| Advanced sub 0.13 µm Cu Devices–Failure Analysis and Circuit Edit With Improved FIB Chemical Processes and Beam Characteristics JD Casey Jr, TJ Gannon, A Krechmer, D Monforte, N Antoniou, N Bassom, ... International Symposium for Testing and Failure Analysis 30774, 553-557, 2002 | 8 | 2002 |
| Controlled silicon thinning for design debug of C4 packaged ICs RR Goruganthu, M Bruce, J Birdsley, V Bruce, G Gilfeather, R Ring, ... 1999 IEEE International Reliability Physics Symposium Proceedings. 37th …, 1999 | 8 | 1999 |
| Reliability of bipolar and MOS circuits after FIB modification R Desplats, JC Courrege, B Benteo, N Antoniou, D Monforte International Symposium for Testing and Failure Analysis 30859, 289-298, 2001 | 7 | 2001 |
| Control of localized access to circuitry through the backside using focused ion beam technology N Antoniou, M Thompson, J Salen, D Casey, RR Goruganthu, R Ring, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1999 | 7 | 1999 |
| The Process of Editing Circuits Through the Bulk Silicon N Antoniou Microelectronic Failure Analysis Desk Ref. 5th ed., edited by EDFAS, ASM …, 2004 | 5 | 2004 |
| Small via high aspect ratio circuit edit: challenges, techniques and developments V Ray, N Antoniou, R Balasubramanian, N Bassom, M Clabby, T Gannon, ... International Symposium for Testing and Failure Analysis 30866, 355-361, 2003 | 5 | 2003 |
| End point of silicon milling using an optical beam induced current signal for controlled access to integrated circuits for backside circuit editing N Antoniou, NJ Bassom, C Huynh, D Monforte, JD Casey, A Krechmer, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 4 | 2002 |
| Improvements of Secondary Electron Imaging and Endpoint Detection in Focused Ion Beam Circuit Modification V Ray, N Antoniou, A Krechmer, A Saxonis International Symposium for Testing and Failure Analysis 30866, 338-342, 2003 | 3 | 2003 |
| Die Backside FIB Preparation for Identification and Characterization of Metal Voids AN Campbell, WF Filter, N Antoniou International Symposium for Testing and Failure Analysis 30835, 317-325, 1999 | 3 | 1999 |
Federico CapassoHarvard UniversityVerified email at seas.harvard.edu
