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Gongxun Bai (白功勋)China Jiliang UniversityVerified email at cjlu.edu.cn
Wenjing JieThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Ming-Kiu TsangThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Zhibin YANGHong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Man Chung WongPost-Doc fellowVerified email at polyu.edu.hk
Sin Yi PangThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Yang ZhangNankai UniversityVerified email at nankai.edu.cn
Zehan WuThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Feng GUOThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
IO Weng FuStudent, The Hong Kong Polytechnic UniersityVerified email at connect.polyu.hk
Long-Biao HuangCity University of Hong KongVerified email at my.cityu.edu.hk
Xianhua WeiSouthwest University of Science and TechnologyVerified email at swust.edu.cn
Zhenping WuBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
Ran Ding (丁 然)College of Electronic Science and Engineering, Jilin UniversityVerified email at jlu.edu.cn
Jianfeng MaoThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
Yongxin LyuPhD student, UNSWVerified email at ad.unsw.edu.au
Huihong LinPostdoc. The Hong Kong Polytechnic UniversityVerified email at hstc.edu.cn
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Jianhua Hao (郝建华)
Chair Professor of Materials Physics and Devices, The Hong Kong Polytechnic University(香港理工大学)
Verified email at polyu.edu.hk - Homepage